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Dynamic Self-Repair Architectures for Defective Through-silicon Vias
양준성,한태희,Darshan Kobla,Edward L. Ju 한국전자통신연구원 2014 ETRI Journal Vol.36 No.2
Three-dimensional integration technology results inarea savings, platform power savings, and an increase inperformance. Through-silicon via (TSV) assembly andmanufacturing processes can potentially introduce defects. This may result in increases in manufacturing and testcosts and will cause a yield problem. To improve the yield,spare TSVs can be included to repair defective TSVs. Thispaper proposes a new built-in self-test feature to identifydefective TSV channels. For defective TSVs, this paperalso introduces dynamic self-repair architectures usingcode-based and hardware-mapping based repair.
Test Point Insertion with Control Point by Greater Use of Existing Functional Flip-Flops
양준성,Nur A. Touba 한국전자통신연구원 2014 ETRI Journal Vol.36 No.6
This paper presents a novel test point insertion (TPI)method for a pseudo-random built-in self-test (BIST) toreduce the area overhead. Recently, a new TPI method forBISTs was proposed that tries to use functional flip-flopsto drive control test points instead of adding extradedicated flip-flops for driving control points. Thereplacement rule used in a previous work has limitationspreventing some dedicated flip-flops from being replacedby functional flip-flops. This paper proposes a logic coneanalysis–based TPI approach to overcome the limitations. Logic cone analysis is performed to find candidatefunctional flop-flops for replacing dedicated flip-flops. Experimental results indicate that the proposed methodreduces the test point area overhead significantly withminimal loss of testability by replacing the dedicated flipflops.