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동일한 평면을 가진 전통목조건축물의 상시미동계측 기반 동적특성 비교 - 3간 팔작지붕 정자건축물을 대상으로 -
김원종(Kim, Won-Jong),신은미(Shin, Eun-Mi),하태욱(Ha, Tae-Uk),김형준(Kim, Hyung-Jun) 대한건축학회 2021 대한건축학회 학술발표대회 논문집 Vol.41 No.2
The purpose of this study is to confirm the dynamic properties of two traditional wooden buildings that are same-sized shape to each other through microtremor measurement. Microtremor measurement was performed each buildings in order to confirm modal natural frequency and mode shape and human excitation was also performed in order to confirm damping ratio.
Wire Bonding Head Horn 설계 및 유한요소해석
김원종(Won-Jong Kim),황은하(Eun-Ha Hwang) 한국산업융합학회 2012 한국산업융합학회 논문집 Vol.15 No.4
Ultrasonic meching technoloy has been developed over recent years for wire bonding.In this study, ultrasonic welding horn is analysed and designed with FEM, then manufactured based on it. The wire bonding mechine has been designed by conical horn model with very easy to come by and is readily accessible. The analysis is carried out by SoldEdge & Ansys software.
데이터 마이닝을 활용한 한국 프로야구 구단의 승패예측과 승률 향상을 위한 전략 도출 연구
김원종 ( Kim Won-jong ),최연식 ( Choi Yeon-sik ),유동희 ( Yoo Dong-hee ) 한국스포츠산업경영학회 2018 한국스포츠산업경영학회지 Vol.23 No.3
본 연구에서는 데이터 마이닝 기법을 활용하여 한국 프로야구의 승패예측모형을 구축하는 실험을 진행하였다. 이를 위해, 2017년에 실시된 한국 프로야구 10개 구단의 전체 경기 중 무승부 경기를 제외한 1,418경기에 대한 자료를 사용하였다. 승패예측모형에는 의사결정나무, 베이즈넷, 인공신경망 알고리즘과 앙상블 기법인 배깅과 부스팅이 사용되었으며, 그 결과 배깅 기법에 인공신경망을 적용한 예측모형에서 가장 높은 예측률인 85.18%를 기록하였다. 다음으로 의사결정나무 기반 예측모형을 활용하여 한국 프로야구 전체 구단에 관한 8개의 승패규칙을 도출하였다. 여기에서 승패규칙은 승패예측에 영향을 미치는 주요 요인들인 팀출루율, 팀타율, 피안타, 안타, 타석, 타수로 표현되며, 도출된 규칙을 바탕으로 구단의 승률 향상에 도움을 주는 전략을 제안하였다. 또한 플레이오프 진출 구단과 미진출 구단에 관한 승리규칙을 각각 4개씩 도출하였고 이를 바탕으로 두 집단에 맞춤화된 승률 향상 전략을 제시하였으며, 실제 구단에서 선수를 영입한 방향과의 비교를 통해 제시된 전략의 활용 가능성을 확인하였다. This study conducted an experiment to develop win-loss prediction models for the Korean professional baseball league using data mining techniques. To this end, we used data on 1,418 games from all games played by the ten Korean professional baseball teams in 2017, except draw games. We developed win-loss prediction models using not only a decision tree, Bayse net, and artificial neural network algorithms, but also ensemble methods, such as bagging and boosting. As a result, first, we found that the artificial neural network-based prediction model using the bagging method reported the best accuracy (85.18%). Second, we derived eight win-loss rules for entire teams from the decision tree-based prediction model. These rules consist of six influential factors: team on base average, team batting average, hit by opponent, hit, plate appearances, and at bat. Using the derived rules, we proposed helpful strategies for improving the winning rate. Third, we derived four winning rules for both playoff teams and non-playoff teams; using the rules we proposed customized strategies for improving the winning rate of the two different groups. Finally, we confirmed the feasibility of the proposed strategies by comparing non-playoff teams’ actual player recruitment strategies.
공리적 설계 방법에 의한 Bonding Mechine의 개념 설계
김원종(Won-Jong Kim),황은하(Eun-Ha Hwang) 한국산업융합학회 2014 한국산업융합학회 논문집 Vol.17 No.4
Bonding Machine is new concept of semi industry. In this study, bonding machine is designed with aximatic design, then manufactured based on it. Axiomatic design offers a scientific base for design in an efficient way. Many application of the independence axiom have been pulished, however, the information axiom has been mainly applied to FR - DP problems except for few case studies.
Chip Bonding Machine Base 구조해석에 관한 연구
김원종(Won-Jong Kim),황은하(Eun-Ha Hwang) 한국산업융합학회 2012 한국산업융합학회 논문집 Vol.15 No.2
This study is concerned about the design and structural analysis of high integrated Chip Bonding Machine. Recently, many studies have been undergoing to reduce a working time in a field of Chip Bonding Machine. Chip Bonding Machine belongs to reduce a stand-by time by Chip Moving time. The developed system can save tool moving distance in small space than other machine. The analysis is carried out by SoldEdge & Ansys software.
Leadframe Feeder Heat Rail의 설계와 검증
김원종(Won-Jong Kim),황은하(Eun-Ha Hwang) 한국산업융합학회 2012 한국산업융합학회 논문집 Vol.15 No.1
Trends in semiconductor equipment industry are to reduce the cost of producing semiconductor, semiconductor process development, facility development, and the minimum investment in terms of cost and quality. Semiconductor equipments are being considered to review and development is proceeding at the same time. In the first part of the semiconductor assembly process, in which the importance of die bonding process is emerging, a wide leadframe type die bonding machine is demanded for productivity. Die bonding machine was designed through experiments and by trial and error. It costs a lot of time and financial burden. The purpose of this study is to solve these problems by using the CAE tool 3G. By using finite element method, thermal analysis of die bonding machine to the various widths leadframe die bonder machine rail is performed for design.