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효율적인 레퍼런스 데이터 그룹의 활용에 의한 마커리스 증강현실의 구현
구자명,조태훈,Koo, Ja-Myoung,Cho, Tai-Hoon 한국정보통신학회 2009 한국정보통신학회논문지 Vol.13 No.11
본 논문은 레퍼런스(reference) 데이터 그룹을 효율적으로 생성하고 활용한 마커리스 증강현실(Markerless Augmented Reality)의 구현 방법을 제안한다. 카메라 설정과 레퍼런스 데이터 그룹 생성, 트래킹 (tracking) 부분으로 되어 있다. 효율적인 레퍼런스 데이터 그룹을 생성하기 위해서는 CAD모델과 같은 3D모델을 필요하며, 다양한 관점에서 본 레퍼런스 데이터 그룹을 생성해야 한다. 모델에 대한 영상에서 특징점들을 추출하고, 광선 추적법을 이용하여 그 특징점에 대응하는 3D좌표를 추출하여, 모델의 특징점들에 대한 2D/3D 대응접의 레퍼런스 데이터 그룹이 구성된다. 트래킹 할 때 현재 프레임영상에서 특징점 들이 가장 많이 매칭되는 레퍼런스 데이터와 그 주위의 모델 데이터만을 이용하기 때문에 빠르게 트래킹할 수 있다. This paper presents how to implement Markerless Augmented Reality and how to create and apply reference data sets. There are three parts related with implementation: setting camera, creation of reference data set, and tracking. To create effective reference data sets, we need a 3D model such as CAD model. It is also required to create reference data sets from various viewpoints. We extract the feature points from the mode1 image and then extract 3D positions corresponding to the feature points using ray tracking. These 2D/3D correspondence point sets constitute a reference data set of the model. Reference data sets are constructed for various viewpoints of the model. Fast tracking can be done using a reference data set the most frequently matched with feature points of the present frame and model data near the reference data set.
GPGPU 기반의 변위증분 방법을 이용한 중간시점 고속 생성
구자명,서영호,김동욱,Koo, Ja-Myung,Seo, Young-Ho,Kim, Dong-Wook 한국정보통신학회 2013 한국정보통신학회논문지 Vol.17 No.8
자유시점 또는 오토스테레오스코픽 비디오 서비스는 3차원 영상을 제공하는 차세대 방송 시스템으로, 여러 시점의 영상들이 필요하다. 본 논문에서는 가상 시점 영상을 고속 생성하기 위해 알고리즘 병렬 구조를 최적화하고, Compute Unified Device Architecture(CUDA)를 이용한 General Propose Graphic Processing Unit(GPGPU) 기반의 중간시점 영상 고속 생성을 위한 최적화 기법을 제안한다. 제안한 방법은 좌/우 깊이영상을 병렬화시킨 스테레오 정합알고리즘을 이용하여 변위정보를 얻은 후, 깊이 당 변위증분을 계산하여 사용한다. 계산된 변위증분을 사용하여 해당 각 화소들의 깊이 값을 이용하여 좌/우 영상들을 원하는 위치의 중간시점으로 영상을 이동시킨다. 그 다음, 비폐색영역들을 서로 상호 보완하여 없앤 다음에 남은 홀들은 홀 필링으로 없애 최종 중간시점 영상을 생성한다. 제안한 방법을 구현하여 여러 실험 영상에 적용한 결과, 생성된 중간시점 깊이영상의 화질은 평균 PSNR 30.47dB이었으며, Full HD급 중간시점 영상을 초당 38 프레임 정도 생성하는 속도를 보였다. Free-view, auto-stereoscopic video service is a next generation broadcasting system which offers a three-dimensional video, images of the various point are needed. This paper proposes a method that parallelizes the algorithm for arbitrary intermediate view-point image fast generation and make it faster using General Propose Graphic Processing Unit(GPGPU) with help of the Compute Unified Device Architecture(CUDA). It uses a parallelized stereo-matching method between the leftmost and the rightmost depth images to obtain disparity information and It use data calculated disparity increment per depth value. The disparity increment is used to find the location in the intermediate view-point image for each depth in the given images. Then, It is eliminate to disocclusions complement each other and remaining holes are filled image using hole-filling method and to get the final intermediate view-point image. The proposed method was implemented and applied to several test sequences. The results revealed that the quality of the generated intermediate view-point image corresponds to 30.47dB of PSNR in average and it takes about 38 frames per second to generate a Full HD intermediate view-point image.
하나의 웨이퍼 전체 영상을 이용한 웨이퍼 Pre-Alignment 시스템
구자명,조태훈,Koo, Ja-Myoung,Cho, Tai-Hoon 한국반도체디스플레이기술학회 2010 반도체디스플레이기술학회지 Vol.9 No.3
This paper presents a wafer pre-alignment system which is improved using the image of the entire wafer area. In the previous method, image acquisition for wafer takes about 80% of total pre-alignment time. The proposed system uses only one image of entire wafer area via a high-resolution CMOS camera, and so image acquisition accounts for nearly 1% of total process time. The larger FOV(field of view) to use the image of the entire wafer area worsen camera lens distortion. A camera calibration using high order polynomials is used for accurate lens distortion correction. And template matching is used to find a correct notch's position. The performance of the proposed system was demonstrated by experiments of wafer center alignment and notch alignment.
헤어와 메이크업 일러스트레이션 기법 연구 -사실적 표현기법에 의한 작품제작을 중심으로-
구자명 한국패션뷰티학회 2003 한국패션뷰티학회지 Vol.1 No.1
This research is to provide practical help in learning hair and makeup illustration skills by presenting techniques for hair and makeup drawing; to serve efficient illustration education; and to enhance the status of beauty and contribute to artistic development. Hair style and makeup techniques include graphical one, pattern-centered one, one using pattern paper, simplifying one and mood one expressing image. Of them, this research made the illustrations to use cosmetics, color pencils and pastel based on the graphical technique. for each design of the illustrations, ethnic, sexy, natural, romantic and gorgeous images, which were considered to be appropriate to the graphical technique, were chosen by the researcher out of hair and makeup styles that appeared in the fashion magazines including Vogue, Gap, Mode et Mode from 2000 through 2001. In particular, they were chosen with focusing on basic styles. The summaries below were found with the experience of making illustrations. Various techniques and skills are required to express the ideas of hair and makeup styles. Of them, the graphical technique is very useful as the primary step to learn various techniques and improve drawing skills. First, the graphical technique may enable not only expressing what is desired to draw as is, but also accurately representing hair and makeup designs so as to convey objective expression. In this regard, it is a proper way to achieve its inherent purpose as conveyance of messages. Second, more accurate styling of hair and makeup is available through graphical expression, which helps understand related practical techniques. In addition, makeup illustration, which is expressed through direct makeup products and instruments, may serve skill improvement since such direct use provides the feeling of real makeup. Third, the graphical technique as a basic drawing skill may unrestrictedly show the artist's expression ability. Fourth, although artistic merits implying individuality and creativity should be shared through illustrations that express the artist's ideas or emotions, the graphical technique is the easiest method to beginners who just started learning of illustration, in that it enables expression without highly advanced skills.
연성인쇄회로기판 상에 Au 스터드 플립칩 범프의 초음파 접합
구자명,김유나,이종범,김종웅,하상수,원성호,서수정,신미선,천평우,이종진,정승부,Koo, Ja-Myeong,Kim, Yu-Na,Lee, Jong-Bum,Kim, Jong-Woong,Ha, Sang-Su,Won, Sung-Ho,Suh, Su-Jeong,Shin, Mi-Seon,Cheon, Pyoung-Woo,Lee, Jong-Jin,Jung, Seung-Boo 한국마이크로전자및패키징학회 2007 마이크로전자 및 패키징학회지 Vol.14 No.4
본 연구의 목적은 OSP, 전해 Au과 무전해 Ni/Au로써 표면처리를 달리한 연성회로기판 상에 Au 스터드 플립칩 범프의 초음파 접합 가능성을 연구하는 것이었다. Au 스터드 범프는 표면처리 방법에 상관없이 성공적으로 연성회로기판의 패드 상에 초음파 접합되었다 접합 강도는 접합 시간에 민감하게 영향을 받았다. 접합 시간이 길어짐에 따라 접합 강도는 증가하였으나, 2초 이상의 접합 시간에서는 이웃 범프끼리 단락되는 bridge 현상이 발생하였다. 최적 접합조건은 OSP 처리된 가판상에 0.5초간 초음파 접합하는 것이었다. This study was focused on the feasibility of ultrasonic bonding of Au stud flip chip bumps on the flexible printed circuit board (FPCB) with three different surface finishes: organic solderability preservative (OSP), electroplated Au and electroless Ni/immersion Au (ENIG). The Au stud flip chip bumps were successfully bonded to the bonding pads of the FPCBs, irrespective of surface finish. The bonding time strongly affected the joint integrity. The shear force increased with increasing bonding time, but the 'bridge' problem between bumps occurred at a bonding time over 2 s. The optimum condition was the ultrasonic bonding on the OSP-finished FPCB for 0.5 s.
BGA 솔더 접합부의 기계적.전기적 특성에 미치는 리플로우 횟수의 효과
구자명,이창용,정승부,Koo, Ja-Myeong,Lee, Chang-Yong,Jung, Seung-Boo 한국마이크로전자및패키징학회 2007 마이크로전자 및 패키징학회지 Vol.14 No.4
본 연구에서는 리플로우 횟수를 달리하여 Sn-37Pb, Sn-3.5Ag와 Sn-3.5Ag-0.75Cu (all wt.%) BGA 솔더 접합부들을 OSP가 코팅된 Cu 패드 상에 형성시킨 후, 기계적 전기적 특성을 연구하였다. 주사전자현미경 분석 결과, 접합 계면에 생성된 $Cu_6Sn_5$ 금속간화합물 층의 두께는 리플로우 횟수가 증가함에 따라 증가하였다. Sn-Pb와 Sn-Ag-Cu 솔더 접합부의 경우, 3회 리플로우 후 최대 전단 강도를 나타내었으며, Sn-Ag 솔더 접합부의 경우 4회 리플로우 후 최대 전단 강도를 나타내었다. 이후 리플로우 횟수가 10회까지 증가함에 따라 전단 강도는 점차 감소하였다. 리플로우 횟수가 증가함에 따라 전기적 특성은 점차 감소하였다. In this study, the mechanical and electrical properties of three different ball grid array (BGA) solder joints, consisting of Sn-37Pb, Sn-3.5Ag and Sn-3.5Ag-0.75Cu (all wt.%), with organic solderability preservative (OSP)-finished Cu pads were investigated as a function of reflow number. Based on scanning electron microscopy (SEM) analysis results, a continuous $Cu_6Sn5$, intermetallic compound (IMC) layer was formed at the solder/substrate interface, which grew with increasing reflow number. The ball shear testing results showed that the shear force peaked after 3 reflows (in case of Sn-Ag solder, 4 reflows), and then decreased with increasing reflow number. The electrical property of the joint gradually decreased with increasing reflow number.