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朴 容 焕,(Yong-Hwan Park) 호서대학교 공업기술연구소 2000 공업기술연구 논문집 Vol.19 No.1
Heat transfer analysis on the new designs of the hot plate for wafer processing was carried out to get better temperature performance than the reference model. The results showed that uniform heat generation in the heater of the reference model for 200mm wafer gave more than 土 0.4 °C variation from the target temperature of 150°C. But new design based on the change of heating area together with different heat generation rate resulted in total variation of 0.463 °C and 0.297 °C on the top of the plate, which are 45% and 63% improvement respectively in the sense of temperature uniformity.