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      • KCI등재

        Calcination temperature and molar ratio effects of nanosized CeO2 and La2O3/γ-Al2O3 synthesized within reverse micelles of surfactant/cyclohexane/ water microemulsion

        Roshanak Lotfi,Saeid Abedini Khorrami 한양대학교 세라믹연구소 2016 Journal of Ceramic Processing Research Vol.17 No.9

        A porous composite of ceria and lanthana/g-alumina was prepared by inverse microemulsion method. The precursor is heatedat several calcination temperature between 823 to 1123 K. Also, the effect of different molar ratio of Ce : La on thecrystallization was studied. The study of X-ray diffraction (XRD), transmission electron microscopy (TEM), scanning electronmicroscopy (SEM) and temperature programmed reduction (TPR) suggested that well crystalline nanosized particles areobtained. The product samples possess mesoporosity with broadly distributed pores between 14 to 22 nm diameter. Surfacearea increases by increasing the calcination temperature. Also, the particle size of the composite samples decreases with anincreasing in molar ratio of Ce : La.

      • KCI등재

        Surfactant effect on synthesize of SrAl2O4 nanoparticles prepared by reverse micelle process

        Azita Moheb,Saeid Abedini Khorramie,Shahram Moradi Dehaghi 한양대학교 세라믹연구소 2019 Journal of Ceramic Processing Research Vol.20 No.2

        Strontium aluminate (SrAl2O4) spinel nanoparticles were synthesized by microemulsion method using micro-reactors made ofdifferent nonionic surfactants (Span 20, Span 40 and Span 60) in a nonpolar solvent cyclohexane. The synthesizednanomaterials were characterized by X-ray diffraction (XRD) technique. The morphology of the synthesized materials wasstudied by field emission scanning electron microscope (FESEM). The average particles size was estimated by XRD andtransmission electron microscope (TEM) with using software of IMAGE J. The effect of different surfactants on the particlessize and morphology was determined. It was found that the average particles size was decreased by decreasing HLB(Hydrophilic-Lipophilic Balance) of surfactants and also the average particles size was decreased from 31 to 21 nm. HLB ofsurfactants is a major factor in controlling the final particles size of SrAl2O4 powder. Dislocation of peaks (2θ) in XRD withdecreasing HLB of surfactant was decreased slightly. The XRD analysis of all the powders indicated the formation of singlephasespinel structure on calcinations.

      • KCI등재

        Surfactant effect on synthesize of BaAl2O4 nanoparticles prepared by reverse micelle process

        Azita Moheb,Saeid Abedini Khorramie,Shahram Moradi Dehaghi 한양대학교 세라믹연구소 2019 Journal of Ceramic Processing Research Vol.20 No.3

        Barium aluminate (BaAl2O4) spinel nanoparticles were prepared by a reverse micelle method using micro-reactors made ofdifferent nonionic surfactants (Span 20, Span 40 and Span 60) in a nonpolar solvent benzene. The synthesized nanomaterialswere characterized by X-ray diffraction (XRD) technique. The morphology of the synthesized materials was studied by fieldemission scanning electron microscope (FESEM). Particle size was estimated by XRD and transmission electron microscope(TEM) with using software of ImageJ. The effect of different surfactants on the particles size and morphology was determined. The results revealed, that particle size was increased by decreasing HLB (Hydrophilic-Lipophilic Balance) of surfactants andalso particle size was increased from 23 to 35 nm. HLB of surfactants is a major factor in controlling the final particles sizeof BaAl2O4 powder. The X-ray powder diffraction analysis indicated, all the formation of hexagonal phase on calcinations. Dislocation of peaks (2θ) in XRD with decreasing HLB of surfactant was decreased slightly.

      • SCIESCOPUS

        Investigating the Au-Cu thick layers Electrodeposition Rate with Pulsed Current by Optimization of the Operation Condition

        Babaei, Hamid,Khosravi, Morteza,Sovizi, Mohamad Reza,Khorramie, Saeid Abedini The Korean Electrochemical Society 2020 Journal of electrochemical science and technology Vol.11 No.2

        The impact of effective parameters on the electrodeposition rate optimization of Au-Cu alloy at high thicknesses on the silver substrate was investigated in the present study. After ensuring the formation of gold alloy deposits with the desired and standard percentage of gold with the cartage of 18K and other standard karats that should be observed in the manufacturing of the gold and jewelry artifacts, comparing the rate of gold-copper deposition by direct and pulsed current was done. The rate of deposition with pulse current was significantly higher than direct current. In this process, the duty cycle parameter was effectively optimized by the "one factor at a time" method to achieve maximum deposition rate. Particular parameters in this work were direct and pulse current densities, bath temperature, concentration of gold and cyanide ions in electrolyte, pH, agitation and wetting agent additive. Scanning electron microscopy (SEM) and surface chemical analysis system (EDS) were used to study the effect of deposition on the cross-sections of the formed layers. The results revealed that the Au-Cu alloy layer formed with concentrations of 6gr·L<sup>-1</sup> Au, 55gr·L<sup>-1</sup> Cu, 24 gr·L<sup>-1</sup> KCN and 1 ml·L<sup>-1</sup> Lauryl dimethyl amine oxide (LDAO) in the 0.6 mA·cm<sup>-2</sup> average current density and 30% duty cycle, had 0.841 ㎛·min<sup>-1</sup> Which was the highest deposition rate. The use of electrodeposition of pure and alloy gold thick layers as a production method can reduce the use of gold metal in the production of hallow gold artifacts, create sophisticated and unique models, and diversify production by maintaining standard karats, hardness, thickness and mechanical strength. This will not only make the process economical, it will also provide significant added value to the gold artifacts. By pulsating of currents and increasing the duty cycle means reducing the pulse off-time, and if the pulse off-time becomes too short, the electric double layer would not have sufficient growth time, and its thickness decreases. These results show the effect of pulsed current on increasing the electrodeposition rate of Au-Cu alloy confirming the previous studies on the effect of pulsed current on increasing the deposition rate of Au-Cu alloy.

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