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A review on the joining of SiC for high‑temperature applications
Dang‑Hyok Yoon,Ivar E. Reimanis 한국세라믹학회 2020 한국세라믹학회지 Vol.57 No.3
A review on the joining of SiC is given in response to the interest surge on this material for a number of applications. Because the engineering design for the majority of applications requires complicated shapes, there has been a strong demand for the development of reliable joining techniques for SiC, especially for high-temperature applications. However, the joining of SiC-based materials is inherently difficult because of the high degree of covalent bonding in SiC and the low self-diffusivity. This review discusses basic mechanisms and properties of the SiC joining techniques developed to date; they are divided into eight different categories. In addition, critical assessment is given for each technique in the context of high-temperature application (≥ 1000 °C). Finally, comments are provided for the use of these techniques in advanced nuclear reactors where stringent irradiation stability under neutron irradiation as well as hermeticity and joint strength are required.