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        Sputter-Redeposition Method for the Fabrication of Automatically Sealed Micro/Nanochannel using FIBs

        김흥배,Gerhard Hobler,Andreas Steiger,Alois Lugstein,Emmerich Bertagnolli,Elmar Platzgummer,Hans Loeschner 한국정밀공학회 2011 International Journal of Precision Engineering and Vol. No.

        In this article, we report a new method for micro/nano fluidic channel fabrication by focused ion beams (FIB) utilizing the redeposition flux, or what we will refer to in this paper as SRM (sputter-redeposition method). Sputtered particles are byproduct of sputter process whereas it limits the focused ion beam (FIB) process. However, the sputtered particles can be useful in the fabrication of certain shapes of structures. The objective of this article is the demonstration of active utilization of the sputtered particles. A micro/nano-fluidic channel fabrication is demonstrated for the topic. As an application, in the fluidic channel fabrication we demonstrate two-step process; trench formation and automatic sealing in the micro-/nanometer range. This method channels from hundreds to tens of nanometers wide can be fabricated by using silicon as a channel substrate. The shape and dimensions of the channel cross-section are readily changed by varying the process parameters. This control of redeposition technique is advantageous because of the accuracy and simplicity of the process compare to other fluidic channel fabrication process.

      • SCIEKCI등재

        Sputter-Redeposition Method for the Fabrication of Automatically Sealed Micro/Nanochannel using FIBs

        Kim, Heung-Bae,Hobler, Gerhard,Steiger, Andreas,Lugstein, Alois,Bertagnolli, Emmerich,Platzgummer, Elmar,Loeschner, Hans 한국정밀공학회 2011 International Journal of Precision Engineering and Vol.12 No.5

        In this article. we report a new method for micro/nano fluidic channel fabrication by focused ion beams (FIB) utilizing the redeposition flux. or what we will refer to in this paper as SRM (sputter-redeposition method). Sputtered particles are byproduct of sputter process whereas it limits the focused ion beam (FIB) process. However, the sputtered particles can be useful in the fabrication of certain shapes of structures. The objective of this article is the demonstration of active utilization of the sputtered particles. A micro/nano-fluidic channel fabrication is demonstrated for the topic. As an application, in the fluidic channel fabrication we demonstrate two-step process; trench formation and automatic sealing in the micro-/nanometer range. This method channels from hundreds to tens of nanometers wide can be fabricated by using silicon as a channel substrate. The shape and dimensions of the channel cross-section are readily changed by varying the process parameters. This control of redeposition technique is advantageous because of the accuracy and simplicity of the process compare to other fluidic channel fabrication process.

      • SCOPUSKCI등재

        이온빔을 이용한 마이크로/나노 가공: 형상가공

        김흥배(Heung-Bae Kim),Gerhard Hobler Korean Society for Precision Engineering 2007 한국정밀공학회지 Vol.24 No.10

        Focused ion beams are a potential tool for micro/nano structure fabrication while several problems still have to be overcome. Redeposition of sputtered atoms limits the accurate fabrication of micro/nano structures. The challenge lies in accurately controlling the focused ion beam to fabricate various arbitrary curved shapes. In this paper a basic approach for the focused ion beam induced direct fabricate of fundamental features is presented. This approach is based on the topography simulation which naturally considers the redeposition of sputtered atoms and sputtered yield changes. Fundamental features such as trapezoidal, circular and triangular were fabricated with this approach using single or multiple pass box milling. The beam diameter(FWHM) and maximum current density are 68 ㎚ and 0.8 A/㎠, respectively. The experimental investigations show that the fabricated shape is well suited for the pre-designed fundamental features. The characteristics of ion beam induced direct fabrication and shape formation will be discussed.

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