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Electronics Cooling Using the Porous Metallic Materials
Lucaci Mariana,Orban Radu L.,Lungu Magdalena,Enescu Elena,Gavriliu Stefania 한국분말야금학회 2006 한국분말야금학회 학술대회논문집 Vol.2006 No.1
The paper presents some results regarding the obtaining of some copper heat pipes with a porous copper internal layer for electronic components cooling. The heat pipes were realized by sintering of spherical copper powders of size directly on the internal side of a copper pipe of 18 mm in diameter. The obtained pipes were then brazed in order to obtain a heat pipe of 0.5 m in length. After that, the heat pipe was sealed and filled with a small quantity of distilled water as working fluid. To establish the total heat transport coefficient and the thermal flow transferred at the evaporator, some external devices were realized to allow the heating of the evaporator and the cooling of the condenser. Water heat pipes are explored in the intermediate temperature range of 303 up to 500 K. Test data are reported for copper water heat pipe, which was tested under different orientations. The obtained results show that the water heat pipe has a good thermal transfer performance in the temperatures range between 345 and 463 K.
Sintering of Alloyed Starting from Mechano-composites Powders
Lucaci Mariana,Orban Radu L.,Lungu Magdalena,Enescu Elena,Gavriliu Stefania 한국분말야금학회 2006 한국분말야금학회 학술대회논문집 Vol.2006 No.1
Considering the idea that some properties, especially the mechanical properties of at ambient temperature can be improved by adding of some substitutional/interstitial elements, our goal was to obtain these materials starting from mechano-composites powders. In this aim, using mechanical alloying techniques three type of mechano-composite powders starting from elemental powders were obtained. Then, by reactive sintering in argon atmosphere at temperature over , alloyed materials were realized. This paper presents our research results regarding the microstructural aspects and phase formation in obtained materials.