Soft electronics have attracted considerable attention as a key technology in various advanced fields, including wearable healthcare, electronic skin, and soft robotics. However, their short service lifetimes and complex multi-component structures mak...
Soft electronics have attracted considerable attention as a key technology in various advanced fields, including wearable healthcare, electronic skin, and soft robotics. However, their short service lifetimes and complex multi-component structures make efficient end-of-life (EoL) recycling extremely challenging. Conventional recycling strategies rely on physical disassembly, which inevitably causes cross-contamination and incomplete recovery of constituent materials. Moreover, the widespread use of petroleum-based materials in soft electronics leads to substantial carbon emissions throughout the manufacturing process.
In this study, I present a closed-loop recycling strategy for biomass-based soft electronics by integrating the recycling process into the device design stage. A one-pot chemical separation process was developed using a water/dimethyl carbonate (DMC) biphasic solvent system with trifluoroacetic acid (TFA) as a catalyst. Crosslinked poly(ethyl lipoate) (c-P(EtLp)), derived from biomass, was adopted as the stretchable substrate, and a gelatin-based hydrogel was employed as the ion-conducting electrolyte, enabling carbon emission reduction from the manufacturing to the recycling stage. The eutectic gallium-indium alloy (EGaIn) used as the current collector spontaneously settles to the bottom of the recycling solution owing to its high density (6.4 g cm⁻³), while MXene (Ti3C2Tx) used as the active material migrates to the water/DMC interface through surface protonation under acidic conditions. Upon TFA addition, TFA-induced depolymerization of c-P(EtLp) triggers the simultaneous formation of four distinct layers: an aqueous phase containing gelatin/glycerol/LiCl, a MXene layer at the interface, a DMC phase containing EtLp/bis-PEG-LA, and precipitated EGaIn at the bottom. This single-step process enables the simultaneous separation and recovery of all constituents without any physical disassembly, achieving high recovery yields of 99.8 % for gelatin, 95.3 % for EtLp/bis-PEG-LA, 99.0 % for EGaIn, and 85.0 % for MXene.
Supercapacitors, strain sensors, and electromyography sensors reconstructed from the recovered materials demonstrated performance equivalent to those fabricated from pristine materials in terms of electrochemical characteristics, strain-sensing capability, and biosignal detection performance. Furthermore, the scalability of the proposed approach was demonstrated by processing a total of 55 g of mixed EoL devices of different types in a single batch without pre-sorting. The water and DMC solvents used in the recycling process were also recovered and reused, realizing an extended closed-loop system encompassing both raw materials and process solvents. The material design principles and one-pot recycling process presented in this study offer a promising platform for scalable closed-loop recycling of next-generation eco-friendly soft electronics.