Silicon carbide (SiC) is a key material for next-generation power electronics and high-temperature applications owing to its wide bandgap, excellent thermal stability, and superior chemical resistance. In parallel, epitaxial graphene (EG) grown on SiC...
Silicon carbide (SiC) is a key material for next-generation power electronics and high-temperature applications owing to its wide bandgap, excellent thermal stability, and superior chemical resistance. In parallel, epitaxial graphene (EG) grown on SiC via thermal decomposition has attracted considerable attention due to its wafer-scale uniformity and crystallographic alignment with the underlying substrate. This dissertation investigates the controlled formation of EG on SiC surfaces, the subsequent deposition of SiC thin films using chemical vapor deposition (CVD), and the transfer of deposited SiC layers for substrate-independent device applications.
First, the thermal decomposition behavior of SiC was systematically analyzed to control surface step–terrace structures and graphene thickness. By introducing SiC powder into a confined crucible environment, the effective partial pressure of Si vapor was regulated, enabling quantitative control of step straightness, surface morphology, and graphene thickness. Step alignment was evaluated using AFM-based quantitative analysis methods, revealing that silicon vapor supply plays a crucial role in stabilizing step morphology during high-temperature decomposition. Thermodynamic and kinetic analyses were further conducted to explain the dependence of graphene formation on temperature and vapor pressure conditions.
Subsequently, CVD SiC deposition was performed using methyltrichlorosilane (MTS) as a precursor. Process parameters such as precursor concentration, carrier gas flow, and temperature were optimized for film growth on sapphire and EG/SiC substrates. Structural analyses using XRD, SEM, Raman and TEM demonstrated that deposited films predominantly consist of 3C-SiC exhibiting columnar growth with preferred crystallographic orientation. Comparative analysis showed that EG thickness and growth temperature significantly influence the growth behavior.
Finally, a transfer process for CVD SiC thin films grown on EG/SiC was demonstrated using PMMA-assisted separation at the EG interface. Optical and Raman analyses confirmed successful film separation while preserving graphene on the original substrate, enabling repeated deposition and transfer cycles. This approach provides a pathway for producing transferable SiC thin films applicable to various substrates.
Overall, this work establishes a comprehensive understanding of EG formation, SiC CVD growth behavior, and transferable SiC thin-film fabrication. The results provide practical process guidelines and expand the potential for substrate-independent integration of SiC-based materials in future power electronic and high-temperature device technologies.