m-Aramid is a polymer having relatively high heat resistance and stability, and MgO, a thermally conductive filler, was added into m-aramid to produce a composite film with improved heat dissipation properties. It was confirmed that there was no chang...
m-Aramid is a polymer having relatively high heat resistance and stability, and MgO, a thermally conductive filler, was added into m-aramid to produce a composite film with improved heat dissipation properties. It was confirmed that there was no change in the chemical structure according to the MgO input amount. However, it was confirmed that as the input amount of MgO increased, the mechanical properties of the composite film gradually decreased, and when 50 wt% of MgO was added, it had a tensile strength of 0.539 MPa and the tensile strength was decreased significantly. In addition, as the input amount of MgO increased, the thermal stability of the composite film increased, and the thermal conductivity improved from 0.259 W/mK to 0.354 W/mK through the formation of an effective heat transfer path, but in the case of dielectric properties, the improvement was insignificant because they had similar values as a whole. These results confirm that the improvement of dielectric properties through filler input should be sought through additional research, however it has an effect on the improvement of thermal properties.