고내열 방열 특성을 갖는 PI/MgO 복합 필름의 제조 및 특성

다국어 초록 (Multilingual Abstract)

Polyimide (PI), a high heat-resistant polymer, was reinforced with thermally conductive magnesium oxide (MgO) fillers to fabricate composite films with enhanced thermal stability and heat dissipation properties. Polyamic acid(PAA) solutions blended with varying MgO contents were thermally imidized, confirming complete conversion of PAA to PI in all cases. Morphological analysis indicated that increasing MgO content led to higher filler particle density on the film surface, with partial sedimentation observed due to density differences. Thermal analysis showed that all composites exhibited glass transition temperatures above 380℃ and decomposition temperatures above 500℃. Thermal conductivity increased significantly with MgO addition, rising from 0.272W/m·K for pure PI to 0.423W/m·K at 10wt%, with a steep increase observed beyond 8wt% due to the formation of effective heat transfer pathways. In contrast, mechanical properties declined with increasing MgO loading, as tensile strength decreased from 10.95MPa for pure PI to 4.20MPa at 10wt%, accompanied by reduced elongation at break. These results demonstrate the potential of PI/MgO composites as heat-resistant materials with tunable thermal conductivity, albeit with compromised mechanical performance at higher filler contents.

목차 (Table of Contents)

• 1. 서론 1
• 1.1 연구배경· 1
• 1.2 연구목적· 9
• 2. 실험 및 방법· 10
• 2.1 PAA 및 PAA/MgO 비율별 용액 제조 10
• 2.2 PI 및 PI/MgO 복합필름 제조 11
• 2.3 적외선분광기 (FT-IR) 13
• 2.4 광학현미경 (OM) 13
• 2.5 주사전자현미경 (SEM)· 14
• 2.6 열중량 분석기 (TG-DGA) 14
• 2.7 동적기계분석기 (DMA)· 15
• 2.8 열전도도 측정· 15
• 2.9 만능재료시험기 (UTM)· 16
• 3. 결과 및 고찰· 17
• 3.1 PI 및 PI/MgO 복합필름의 이미드화 분석· 17
• 3.2 PI 및 PI/MgO 복합필름의 표면 및 단면 모폴로지 분석 20
• 3.3 PI 및 PI/MgO 복합필름의 열적 특성· 29
• 3.4 PI 및 PI/MgO 복합필름의 열전도도 특성· 36
• 3.5 PI 및 PI/MgO 복합필름의 기계적 특성· 40
• 4. 결론· 43
• 참고문헌 44
• Abstract 56