The increasing demand for lightweight and durable materials in industries such as automotive, aerospace, and electronics has driven the development of heterojunction bilayer composites that combine the structural integrity of metals with the versatili...
The increasing demand for lightweight and durable materials in industries such as automotive, aerospace, and electronics has driven the development of heterojunction bilayer composites that combine the structural integrity of metals with the versatility of polymers. This study focuses on the interfacial behavior between stainless steel (SUS) and polyamide 66 (PA66), emphasizing the role of silane coupling agents in enhancing adhesion strength. Systematic surface modifications, characterized by scanning electron microscopy (SEM), atomic force microscopy (AFM), and contact angle measurements, were employed to optimize the surface area, roughness, and energy of SUS. X-ray photoelectron spectroscopy (XPS) confirmed the formation of chemically bonded interphases and guided the selection of effective silane coupling agents. Among the agents tested, aminopropyl triethoxysilane (A1S) and 3-glycidyloxypropyl trimethoxysilane (ES) significantly improved lap shear strength, elongation at break, and toughness, demonstrating efficient interfacial load transfer. These findings underscore the importance of targeted surface treatments and the judicious selection of silane coupling agents in optimizing the interfacial adhesion and mechanical properties of SUS/PA66 composites.
In addition to silane coupling agents, this study investigates the effects of various curing agents on the adhesion performance and mechanical strength of epoxy-bonded SUS/PA66 heterojunction bilayer composites. Surface treatments and epoxy adhesives with amine, acid, and anhydride curing agents were used to enhance interfacial compatibility. Thermogravimetric analysis (TGA), differential scanning calorimetry (DSC), Fourier transform infrared (FTIR) spectroscopy, and scanning electron microscopy (SEM) characterized the thermal stability, chemical interactions, and morphology of the cured resins. Results showed that acid-based curing agents provided the highest lap shear strength and strongest adhesion with SUS, while anhydride-based agents, despite yielding high tensile strengths, exhibited limited bonding performance with SUS. Contact angle measurements indicated improved wettability for surface-treated SUS, which further enhanced adhesion. These findings highlight the superior compatibility of amine- and acid-based curing agents with SUS/PA66 composites, offering valuable insights for the fabrication of lightweight, high-performance materials in advanced engineering applications.