Two-dimensional (2D) quantum materials such as Graphene, Hexagonal boron nitide (h-BN), and Molybdenum disulfide (MoS2) have been synthesized using methods such as epitaxy, Chemical Vapor Deposition (CVD), and mechanical exfoliation. Substrates such a...
Two-dimensional (2D) quantum materials such as Graphene, Hexagonal boron nitide (h-BN), and Molybdenum disulfide (MoS2) have been synthesized using methods such as epitaxy, Chemical Vapor Deposition (CVD), and mechanical exfoliation. Substrates such as Silicon Carbide (SiC), Copper, Nickel, and Sapphire are commonly used in epitaxial and CVD processes. To integrate 2D quantum materials into commercial electron devices, it is essential to develop techniques that enable their direct growth on commercially viable substrates, eliminating the need for a separate transfer process.
However, conventional SiO2/Si wafers exhibit chemical inhomogeneity and high surface roughness, and epitaxial growth using SiC wafer is limited to graphene. This has led to a demand for the development of new substrates that are chemically uniform and atomically flat. Recent studies have proposed Silicon Oxynitride (SiON) thin film grown on SiC as a promising platform for the growth of 2D quantum materiasl. There have also been reports of graphene being transferred onto SiON/SiC wafers after CVD growth.
In this study, we successfully achieved the direct growth of multi-layer graphene on SiON/SiC wafers via a CVD process. By adjusting the partial pressure of Argon gas and the annealing time during the pre-growth annealing step, we were able to control the number of graphene layers from mono-layer to tri-layer. This layer control was confirmed through Atomic Force Microscope (AFM) and Raman spectroscopy analyses. Our results present a new possibility for developing 2D quantum material-based devices without requiring a transfer process.
Furthermore, to enhance the quality of the grown graphene, we implemented a transient gas retention effect by placing the SiO2 substrate inside a tubular alumina structure during the graphene growth process. This setup allowed intentional control of gas inflow and outflow within the structure, which reduced defects and improved the uniformity of the graphene. Raman spectroscopy further confirmed the improved quaility of the grown graphene
These results demonstrate that direct growth of graphene on silicon-based substrates can enable precise control of the number of layers while simultaneously reducing defect density and improving thickness uniformity across the sample. Such improvements provide a solid foundation for the realization of layer-sensitive two-dimensional semiconductor devices, including tunneling field-effect transistors, whose performance is governed by tunneling barrier thickness, and TMDC-based optoelectronic devices, in which optical and electronic properties strongly depend on the number of layers.