This study demonstrates a hybrid fabrication method that integrates direct ink writing (DIW) with localized laser sintering to produce a multi-material device consisting of a tungsten heater and a silver temperature sensor. Dispensing parameters for t...
This study demonstrates a hybrid fabrication method that integrates direct ink writing (DIW) with localized laser sintering to produce a multi-material device consisting of a tungsten heater and a silver temperature sensor. Dispensing parameters for tungsten ink were characterized to determine conditions for stable printing, and the irradiation characteristics of UV laser were analyzed to identify the beam diameter and its role in the sintering process. The electrical conductivity of the laser-sintered tungsten patterns increased with laser power and decreased with scan speed. The conductivity increased with increasing laser energy density and reached 2.61 × 105 S/m. Microstructural analysis showed particle fragmentation, cluster formation, and directional rod-like grain growth as laser energy density increased. Heat-transfer simulations confirmed that the laser supplied rapid localized heating sufficient for tungsten sintering, while XRD verified that the α-W phase remained unchanged. Heaters with meander and spiral square geometries were evaluated, and the spiral square design produced the most uniform temperature field. Printed silver sensors exhibited linear up to 300 °C, with temperature coefficients of resistance around 2.2 × 10-3 /°C. In the integrated device, the sensor-based temperature readings agreed with thermographic measurements within 5%, demonstrating reliable in situ temperature monitoring during heater operation. These results show that laser-based hybrid patterning system enables localized sintering, controlled microstructure development, and stable electrical and thermal performance, offering a practical route for fabricating integrated thermal devices without high-temperature furnaces or controlled atmospheres.