In OLED display manufacturing, the fine metal mask (FMM) is essential for high-resolution patterning of RGB organic materials, and the use of ultra-low thermal expansion materials such as Invar is required to minimize thermally induced geometric disto...
In OLED display manufacturing, the fine metal mask (FMM) is essential for high-resolution patterning of RGB organic materials, and the use of ultra-low thermal expansion materials such as Invar is required to minimize thermally induced geometric distortion.
However, conventional Invar FMMs are produced through rolling and chemical etching–based metallurgical processes, which inherently generate residual stress, reduced flatness, and thickness non-uniformity during thinning. These limitations impose both technical and economic challenges when fabricating ultrathin films below approximately 50 μm.
Although alternative approaches such as FMM-less and photolithography-based patterning technologies have been proposed, their performance remains insufficient to meet the demands of large-area, high-precision deposition processes.
Therefore, next-generation ultra–high-resolution OLED fabrication calls for an advanced FMM manufacturing technology that enables thinner and thermally stable films with improved microstructural controllability.
To address these challenges, this study employed a pulse reverse current (PRC) electroplating process to fabricate ultrathin Fe–Ni Invar films and precisely achieve the target alloy composition of Fe–36 wt% Ni. Unlike DC or conventional pulse plating, PRC incorporates periodic reverse-current intervals, offering advantages including enhanced compositional uniformity, internal stress reduction, defect suppression, and microstructural homogenization. By optimizing saccharin concentration, current density, and waveform parameters, both the composition and microstructure of the electroplated films were effectively controlled.
As a result, uniform Fe–36 wt% Ni films with a thickness of approximately 12 μm were successfully produced. Grain refinement and improved compositional uniformity reduced the coefficient of thermal expansion to as low as 1 ppm/K. To elucidate the correlation between microstructure and CTE, phase evolution and grain size were analyzed using X-ray diffraction and scanning electron microscopy, while thermal expansion behavior was evaluated via thermomechanical analysis. In particular, saccharin-induced suppression of hydrogen incorporation and localized growth was found to promote grain refinement, which significantly influenced structural evolution before and after heat treatment and contributed to CTE reduction.
XRD analysis showed that the as-deposited films exhibited , , and phases, and grain sizes were quantified using the Scherrer equation. After heat treatment, the BCC phase transformed into FCC, yielding ultra-low thermal expansion comparable to metallurgical Invar, with some samples achieving CTE values below 1 ppm/K. Correlation analysis between microstructural parameters (intensity ratio and grain size) and CTE confirmed that the thermal expansion behavior after heat treatment can be predicted from the as-deposited microstructure.
This study establishes the microstructure–thermal property relationship of PRC electroplated Invar films and demonstrates the feasibility of predicting thermal behavior using indicators such as grain size, phase fraction, and XRD intensity ratio. These findings offer a new process pathway for fabricating ultrathin, ultra–low thermal expansion Invar films and provide practical design guidelines for process optimization and quality control in next-generation electroplated Invar FMM manufacturing.