질화붕소 기반 열계면 재료의 열전도 특성 향상 = Enhanced Thermal Conductivity of Boron Nitride?Based Thermal Interface Materials

다국어 초록 (Multilingual Abstract)

Due to its high thermal conductivity (TC) and low electrical conductivity, boron nitride (BN) has emerged as an ideal filler for thermal interface materials (TIMs) that prevent thermal accumulation in nanostructures without causing shutdown via electron tunneling. The polymer composite based on the BN hybrid strategy can be considered an optimal option for electrically insulating and heat-dissipating TIM. However, there is a paucity of systematic experiments and theoretical approaches investigating the optimal content and ratio of BN hybrid fillers, which are key factors in synergistically enhancing TC. In this study, we develop a hybrid thermal percolation model by modifying the Foygel model to investigate the synergistic improvement of systematically measured TC. The model effectively determines the optimal hybrid filler composition and the resultant performance enhancement. Furthermore, the effects of BN surface and interfacial chemistry are comprehensively analyzed in relation to the filler network structure. The highest isotropic TC (10.93 W/m·K) is achieved by optimizing the formation of nano-interconnections between one-dimensional BN nanotube (BNNT) and two-dimensional hexagonal BN (h-BN), corresponding to increases of 1582% and 118% compared with pure epoxy and the composite containing the optimized h-BN network, respectively.

목차 (Table of Contents)

• 1. Introduction 1
• 1.1. Thermal Management Challenges in Miniaturized Electronics 1
• 1.2. Boron Nitride and Hybrid Filler Approaches for TIMs 1
• 1.3. Rationale and Objectives 3
• 2. Experimental 6
• 2.1. Materials 6
• 2.2. Surface Functionalization of Boron Nitride Fillers 6
• 2.3. Composite Fabrication 7
• 2.4. Characterization 10
• 2.4.1. Analysis of Surface Functional Groups 10
• 2.4.2. Morphological Characterization 10
• 2.4.3. Performance Evaluation 11
• 2.4.3.1. Thermal Conductivity Measurement 11
• 2.4.3.2. Electrical Conductivity Measurement 11
• 3. Results and Discussion 12
• 3.1. Theoretical Modeling of Thermal Conductivity 12
• 3.1.1. Nan's Model 12
• 3.1.2. Foygel Model 13
• 3.1.3. Hybrid Thermal Percolation Model 14
• 3.2. Effect of Surface Functionalization 18
• 3.2.1. Surface Functionalization of h-BN 18
• 3.2.2. Morphological and Structural Characterization 22
• 3.3. Thermal Conductivity Evaluation 24
• 3.3.1. Single-Filler Composites 24
• 3.3.2. Hybrid-Filler Composites 26
• 3.3.2.1. Synergistic TC Enhancement 26
• 3.3.2.2. Thermal Percolation Mechanism and Contact Thermal Resistance 26
• 3.3.2.3. Reduced Synergistic Effect 27
• 3.3.3. Optimization of BN Filler Networks for Enhanced Thermal Conductivity 36
• 3.3.3.1. Formation of Nano-Interconnections 36
• 3.3.3.2. Interfacial Engineering for Enhanced Heat Transfer 40
• 3.3.3.3. Summary of Filler Network Optimization Mechanisms 44
• 3.4. Performance Evaluation in Thermal Management 45
• 3.4.1. Electrical Insulation Performance 45
• 3.4.2. Thermal Dissipation Efficiency 50
• 4. Conclusion 52
• 5. Reference 54