Two-dimensional (2D) materials have drawn attention as potential alternatives to conventional Si-based electronics due to their atomic thickness, superior electrostatics, and tunable properties. Despite these advantages, 2D materials often exhibit deg...
Two-dimensional (2D) materials have drawn attention as potential alternatives to conventional Si-based electronics due to their atomic thickness, superior electrostatics, and tunable properties. Despite these advantages, 2D materials often exhibit degraded performance at the metal contact interface, deviating from theoretical expectations. This discrepancy is primarily driven by Fermi level pinning (FLP), which originates from metal-induced gap states (MIGS) and defect-induced gap states (DIGS) at the interface. These gap states effectively suppress the tunability of the Schottky barrier height, limiting the efficiency of carrier injection and device operation. In this study, we provide a comprehensive review of the underlying mechanisms responsible for FLP in 2D material–metal junctions, based on insights obtained from first-principles calculations using density functional theory (DFT). We examine how interfacial chemical bonding, atomic-scale defects, and van der Waals versus direct contacts contribute to the emergence of gap states. We also discuss how strain engineering, contact geometry, and electronic screening influence the interface properties and propose strategies to suppress FLP. The goal of this work is to identify key factors that govern contact behavior and to suggest practical design rules for achieving low-resistance, high-performance 2D electronic devices.